US Patent Issued to AAC Kaitai Technologies (Wuhan) on Nov. 3 for "Acceleration sensor" (Singaporean, Chinese Inventors)

Posted On: 2026-11-03

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,782,383, issued on Nov. 3, was assigned to AAC Kaitai Technologies (Wuhan) Co. LTD. (Wuhan, China). "Acceleration sensor" was invented by Lingch... Read More

US Patent Issued to HITACHI CONSTRUCTION MACHINERY on Nov. 3 for "Speed measurement device" (Japanese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,782,384, issued on Nov. 3, was assigned to HITACHI CONSTRUCTION MACHINERY Co. LTD. (Tokyo). "Speed measurement device" was invented by Hiroki It... Read More

US Patent Issued to SHIMADZU on Nov. 3 for "Scanning probe microscope, information processing method, and program" (Japanese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,782,385, issued on Nov. 3, was assigned to SHIMADZU Corp. (Kyoto, Japan). "Scanning probe microscope, information processing method, and program... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 3 for "Method of forming a plurality of conductive interconnect structures for circuit probe testing of an integrated circuit structure" (Taiwanese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,782,386, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Method of forming a plurality of cond... Read More

US Patent Issued to TOKYO SEIMITSU on Nov. 3 for "Prober with falling restriction mechanism" (Japanese Inventor)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,782,387, issued on Nov. 3, was assigned to TOKYO SEIMITSU Co. LTD. (Hachioji, Japan). "Prober with falling restriction mechanism" was invented b... Read More

US Patent Issued to MPI on Nov. 3 for "Contact probe and contacting member thereof, method of manufacturing contacting member, probe system using the contacting member, method of testing unpackaged semiconductor device, tested semiconductor device and method of producing the same" (Taiwanese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,782,388, issued on Nov. 3, was assigned to MPI Corp. (Chu-Pei City, Taiwan). "Contact probe and contacting member thereof, method of manufacturi... Read More

US Patent Issued to KINSUS INTERCONNECT TECHNOLOGY on Nov. 3 for "Test fixture" (Taiwanese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,782,389, issued on Nov. 3, was assigned to KINSUS INTERCONNECT TECHNOLOGY CORP. (Taoyuan City, Taiwan). "Test fixture" was invented by Ting-Hao ... Read More

US Patent Issued to CHUNGHWA PRECISION TEST TECH. on Nov. 3 for "Probe card device having parallel connection configuration and guide board mechanism thereof" (Taiwanese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,782,390, issued on Nov. 3, was assigned to CHUNGHWA PRECISION TEST TECH. Co. LTD. (Taoyuan City, Taiwan). "Probe card device having parallel con... Read More

US Patent Issued to IBIDEN on Nov. 3 for "Conduction inspection jig and method for manufacturing printed wiring board" (Japanese Inventor)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,782,391, issued on Nov. 3, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Conduction inspection jig and method for manufacturing printed wirin... Read More

US Patent Issued to MPI on Nov. 3 for "Probe cards, DUT side modules of the probe cards, testing methods and systems that include the probe cards, tested devices and methods of producing tested devices by utilizing the probe cards" (Taiwanese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,782,392, issued on Nov. 3, was assigned to MPI Corp. (Chu-Pei City, Taiwan). "Probe cards, DUT side modules of the probe cards, testing methods ... Read More

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US Patent Issued to AAC Kaitai Technologies (Wuhan) on Nov. 3 for "Acceleration sensor" (Singaporean, Chinese Inventors)

US Patent Issued to HITACHI CONSTRUCTION MACHINERY on Nov. 3 for "Speed measurement device" (Japanese Inventors)

US Patent Issued to SHIMADZU on Nov. 3 for "Scanning probe microscope, information processing method, and program" (Japanese Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 3 for "Method of forming a plurality of conductive interconnect structures for circuit probe testing of an integrated circuit structure" (Taiwanese Inventors)

US Patent Issued to TOKYO SEIMITSU on Nov. 3 for "Prober with falling restriction mechanism" (Japanese Inventor)

US Patent Issued to KINSUS INTERCONNECT TECHNOLOGY on Nov. 3 for "Test fixture" (Taiwanese Inventors)

US Patent Issued to CHUNGHWA PRECISION TEST TECH. on Nov. 3 for "Probe card device having parallel connection configuration and guide board mechanism thereof" (Taiwanese Inventors)

US Patent Issued to IBIDEN on Nov. 3 for "Conduction inspection jig and method for manufacturing printed wiring board" (Japanese Inventor)

US Patent Issued to MPI on Nov. 3 for "Probe cards, DUT side modules of the probe cards, testing methods and systems that include the probe cards, tested devices and methods of producing tested devices by utilizing the probe cards" (Taiwanese Inventors)